LC MAGIC employs TOPPAN's advanced liquid crystal display technology to seamlessly switch between transparent and opaque states, making it a cutting-edge solution for smart window privacy and light control.
FC-BGA Substrates
Our proprietary microfabrication and wiring technologies power high-density wiring substrates featuring FC-BGA (flip chip ball grid array), delivering enhanced processing speed and functionality to meet industry needs.
On-Chip Color Filter
As a leading global supplier of color filter arrays, our on-chip color filter technology uses CFA and micro-lens array developments critical for the upstream supply chain demands of digital cameras and smart phones.
Copper Touch Sensor
TOPPAN's microfabrication technologies enhance user experience for a larger, lighter panel using our copper sensor film for PCAP touch panels. Our copper electrode material achieves lower resistance and improved operability.
Metal Etched Materials
TOPPAN uses metal etching technology to selectively remove portions of metal, creating a variety of high-quality products beyond semiconductor packaging. Discover our precision manufacturing capabilities today.