FC-BGA Substrates
Experience TOPPAN America's cutting-edge microfabrication and wiring technologies with our high-density wiring substrates featuring FC-BGA (flip chip ball grid array). Our proprietary techniques enable enhanced processing speed and functionality, meeting the ever-evolving demands of various industries. Discover the exceptional capabilities of FC-BGA technology and harness its potential to elevate the performance of your applications.
Product Lineup
Our diverse product lineup features FC-BGA with various surface finishes, as well as multi-chip FC-BGA and other advanced solutions.
FC-BGA
FC-LGA
Multi-chip FC-BGA
Ultra-multilayer FC-BGA
Coreless FC-BGA
2.3/2.5D FC-BGA
From substrate design to production, we offer end-to-end support to meet the increasing demand for LSIs in high-end processors (server, AI, network) and automotive SoCs, as well as PCs and gaming devices. Solutions for lead-free and halogen-free products are also available.
Versatile Applications
Fine-pitch FC Bump
High-density Support
SR DAM
FC Bump
Pitch = 130µm
FC Bump
Pitch = 110µm
Hyper Build-Up, 5 stack VIA
Land / VIA = 85 / 60µm
Structure of VIA, 10 stack VIA
Land / VIA = 100 / 60µm
Low Copper Roughness Treatment
Features
