Metal Etched Materials
TOPPAN uses metal etching technology to selectively remove portions of metal, creating a variety of high-quality products beyond semiconductor packaging. Discover our precision manufacturing capabilities today.
Diverse Metal Etching Applications
Our versatile metal etching technology, spans a wide array of electronics components like IC card antennas, device internals, and exteriors, as well as elevating decorative items like metal bookmarks, calendars, and beyond.
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Compared to stamping method, etching method applies less stress to the substrate. This results in its suitability for microfabrication. (No material deformation such as burrs, bend, or warp.)
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Etching technology is applied not only for through hole processes, but also for half-etching processes.
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Capable of various types of secondary processing, such as shape profiling (bending / cut-off) surface processing (mirror polishing / coloring / plating), bonding, and insert injection molding.
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Non-conventional design products are welcomed since we have an internal design center.
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Mass production is possible due to Roll-to-Roll Process production.
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Delivery possible in either roll or sheet form.